SEMI IC Inspection & Testing Services
Multi-Tier Laboratory Verification & Anti-Counterfeit Solutions
SEMI IC provides comprehensive component testing services to detect counterfeit, refurbished, and defective electronic components. Protecting your global supply chain with advanced analytical equipment and certified engineering standards.
Visual Inspection
The first line of defense in component quality assurance. SEMI IC performs 100% incoming physical inspection under IDEA-STD-1010 standards to verify packaging integrity, labeling accuracy, and surface physical conditions
Package
Verification of outer carton integrity, ESD bags, desiccants, and humidity indicator cards (HIC) for full moisture protection
Label
Cross-checking brand, part number, lot/date codes, origin, and MSL ratings against factory specifications and SEMI IC’s database.
Packaging Method
Inspection of carrier formats—Tape & Reel, Tray, or Tube—ensuring compliance with manufacturer and ANSI/EIA standards
Dimensions
Precision measurement of body size, pin pitch, and thickness using digital calipers to guarantee datasheet tolerance match
Pins
High-magnification microscopic inspection of leads and BGA balls to detect oxidation, deformation, missing pins, or solder residues
Remarking / Resurfacing Test
Detecting illicit secondary processing and fraudulent component remarking. We apply chemical solvents and physical inspection techniques to uncover hidden surface sanding, blacktopping, and fake original logos
Scrape Test
Physical scraping of the chip surface coating using precision engineering tools to evaluate coating hardness and uncover secondary blacktopping, hidden sanding marks, or underlying original factory laser etchings
Solvent Test
Chemical wipe testing using acetone and specialized industrial solvent mixtures to test surface chemical resistance, verifying whether original part numbers or manufacturer logos have been fraudulently re-marked.
Electrical Test
Verifying fundamental electrical functionality and pin-to-pin signal integrity. Our electrical test suite ensures that incoming components meet basic DC parameters and logic specifications before SMT assembly
Pin-to-Pin Electrical Test
Precision measurement of pin continuity, impedance, and electrical characteristics across terminal pairs to verify internal diode protection, open/short circuit status, and basic functional logic
2.5D/3D Test
Multi-dimensional optical and parametric testing to measure coplanarity, complex pin arrangement, 3D lead pitch alignment, and structural symmetry for high-density IC packages
DC Test
DC parametric testing applying rated voltage and current conditions to evaluate static current consumption, input/output threshold levels, and key electrical limits against manufacturer datasheets
Solderability Test
Preventing cold solder joints and SMT assembly failures. We simulate accelerated thermal aging and soldering environments to verify the tinning reactivity and cleanliness of component pins
Dip and Look Test
Evaluation of component lead solderability under JESD22-B102 standards using controlled solder pot immersion, measuring solder coverage percentage and wetting quality to ensure zero defect rates on automated SMT production lines
Non-Destructive Test
In-depth structural and material diagnostics performed without compromising the physical integrity or functionality of the electronic components
Pin-to-Pin Electrical Test
High-resolution radiographic X-Ray imaging to analyze internal structural uniformity, inspecting leadframe alignment, internal wire bonding integrity, die size consistency, and void ratio across the batch
2.5D/3D Test
X-Ray Fluorescence (XRF) spectral element analysis to determine the precise chemical composition of pin plating, certifying lead-free (ROHS) compliance and identifying hazardous material hazards
Destructive Test
Silicon-level authenticity verification for critical application requirements. Executed on sample batches to verify original semiconductor wafer markings and internal layout architecture
Chemical Decapsulation
Automated acid decapsulation to safely etch away the epoxy resin packaging and expose the silicon die, enabling microscopic inspection of original wafer manufacturer logos, part numbers, mask copyright dates, and circuit layouts
Inspection Standard
SEMI IC strictly adheres to internationally recognized quality operations and military-grade component inspection standards, ensuring complete compliance and audit-ready traceability
Third-Party Testing
For specialized mission-critical, automotive, or aerospace applications, SEMI IC partners with ISO/IEC 17025-accredited independent third-party laboratories to provide authorized, fully certified analytical test reports.
- External Visual Inspection (EVI)
- Material Analysis (XRF)
- X-Ray
- Decapsulation
- Scanning Acoustic Microscopy
- Electrical Test
- Endurance Test
- Analysis and Investigation
- ……
- Permanency Test
- Test Solderability
- Reliability Test
- Authenticity Analysis
- IC Verification Test
- Key Function Test
- RoHS Test
- Pb Free Test
- ……
Get the Parts You Need with 100% Quality Assurance
Submit your BOM or component part numbers to SEMI IC for instant testing quotes and inspection reports